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PCB-CAMERA 39X39 KST
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PCB-CAMERA MULTICOLOR (Type18) 21 kit
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MVS200/EDA1(ICOS) V2272E XC75
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COLLECT<(>&<)>PLACE HEAD DLM2-6 / without cam.
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COLLECT <(>&<)> PLACE HEAD DLM2-12 / without camera
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PCB -CAMERA MULTICOLOR (Typ 24) 28 dig
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COMPONENT-CAMERA C+P(TYPE23)6x6 dig.
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COLLECT <(>&<)> PLACE HEAD RVC-6 NOZZLE
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COMPONENT-CAMERA C+P(Type28) 18x18 digital RK
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CO trolley, docking unit, X-Series, cmpl
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COMP.CAMERA P+P (TYP33) 55x45 digit.
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COMPONENT-CAMERA C+P(Type29) 27x27 digital RK
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COMP.-CAMERA STAT.P+P (Type25)16x16 dig.
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C-O-TABLE DOCK-IN, COMPL. R2
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Pick + Place-Modul/High-Force
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Pick+Place-Modul/THK
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Comp. camera stat. P+P (typ 36) 32*32 digit.
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BE-Camera C+P (Typ38) 16x16 digital RK
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Placement head CPP /without camera
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TURRET HEAD C+P20A/WITHOUT CAMERA
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LP-CAMERA (TYP34) 28 digital RK
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BE camera C+P (type 41) 6x6 digital RK
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12-segm. C+P head DLM4 / w.out sleeves
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IC-Head for CAN Bus NOTICE: Please send the defect IC-Head return quickly in order to get shorter repair times.
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BE-VISION SIPLACE 80F
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PCB-optical system KST
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DP-DRIVE / C+P
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Additional component vision module SIPLACE 80 F/F4/F5 for flip chip bump centering. Field of view: 9mmx11.5mm. Largest flip chip with single measurement: 7mm x 9mm.Smallest,reliably recognizable bump diameter: 0,1mm. Reliable processing of IC pitch: 0,25m