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MVS340-6 VME V2321M calibr.
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Package for placement of 0201 components (size 0.6mm x 0.3mm). Suitable for SIPLACE X-Series (SCSW 605)equipped with the 12-Segment Collect and Place head. The Package includes: High resolution camera (Exchange between standard digital component camera. T
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Package for placement of 0201 components (size 0.6mm x 0.3mm). Suitable for SIPLACE D4i/D2i/D1i equipped with the 12-Segment Collect and Place head. The Package includes: High resolution camera (Exchange against standard digital component camera. The stan
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COT-Insert 30 /P001
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VHF module
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VHF-Twin-module
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Portal Basis Unit SIPLACE 80F 4/6
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Portal SIPLACE 80/ S4
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Pick + Place-Modul/High-Force
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CO trolley insert SX4 vario
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COT insert SX4 speed
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MVS200/EDA1(ICOS) V2272E XC75
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Package for placement of 01005 components (size 0.4mm x 0.2mm). Suitable for the SIPLACE D4/D2/D1 equipped with the 12 Collect & Place Head (DLM3). The component range will be from 01005 up to the maximum of 16mm x 16mm. The package includes: 1 x High res
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BE-Camera C+P (Typ38) 16x16 digital RK
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MVS200/EDA1 (ICOS) V2144E XC75 for Siplace S20F4/6 with SW401.xx/402.xx
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BASE PORTAL SIPLACE S27HM
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COT-Insert 60 /P001
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CONTROL UNIT F4B
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COT Insert SX4
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CO trolley, docking unit, X-Series, cmpl
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COMP.-CAMERA STAT.P+P (Type25)16x16 dig.
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Linear Dipping Unit X
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BASE PORTAL F5 HM
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control unitS23-HM withoutMVS
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Koplan optoNCDT ILD 2200-3
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CO camera, stationary P+P (type 20) 8x8
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Additional component vision module SIPLACE 80 F/F4/F5 for flip chip bump centering. Field of view: 9mmx11.5mm. Largest flip chip with single measurement: 7mm x 9mm.Smallest,reliably recognizable bump diameter: 0,1mm. Reliable processing of IC pitch: 0,25m
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3D Coplanarity Sensor + Transmission