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Additional component vision module SIPLACE 80 F/F4/F5 for flip chip bump centering. Field of view: 9mmx11.5mm. Largest flip chip with single measurement: 7mm x 9mm.Smallest,reliably recognizable bump diameter: 0,1mm. Reliable processing of IC pitch: 0,25m
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Nozzle changer for 6 nozzle C+P Head SIPLACE 80 F4/F5 Station software version 403.xxx or higher Line computer software 403.xxx or higher Option includes: 2 magazines for big nozzles 3 magazines for small nozzles
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BALL BEARING 8*22*7 608 2Z
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BALL BEARING
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DEEP-GROVE BALL BEARING 4*13*5 624-2Z
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DIN 6325-3m5x18-St
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DIN 471-6x0.7-C67
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Disc 6,4 DIN125-A
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SCREW M4*10 DIN965
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DIN 6799 - 8-ST